Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12332882
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Filing Dt:
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12/11/2008
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Publication #:
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Pub Dt:
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05/14/2009
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Inventors:
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Zhi-Wen Sun, Renren He, You Wang, Michael X. Yang
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Title:
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MULTIPLE-STEP ELECTRODEPOSITION PROCESS FOR DIRECT COPPER PLATING ON BARRIER METALS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3050 BOWERS AVENUE |
| SANTA CLARA, CALIFORNIA 95052 |
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| KEITH TABOADA, ESQ. |
| 595 SHREWSBURY AVENUE |
| SUITE 100 |
| SHREWSBURY, NJ 07702 |
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