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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
12084980
Filing Dt:
01/21/2009
Publication #:
Pub Dt:
05/14/2009
Inventors:
Katsumi Ohashi, Masanobu Horino, Yasuhiro Onishi
Title:
SOLDER MATERIAL INSPECTING DEVICE
Assignment: 1
Reel/Frame:
022168/0882Recorded: 01/21/2009Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/14/2008
Exec Dt:
05/14/2008
Exec Dt:
05/14/2008
Assignee:
801 MINAMIFUDODO-CHO, HORIKAWAHIGASHIIRU
SHIOKOJI-DORI, SHIMOGYO-KU, KYOTO
KYOTO-SHI, JAPAN 600-3530
Correspondent:
WILLIAM T. ELLIS
FOLEY & LARDNER LLP
WASHINGTON HARBOUR
3000 K STREET NW, SUITE 500
WASHINGTON, D.C. 20007-5143
Assignment: 2
Reel/Frame:
022444/0070Recorded: 03/19/2009Pages: 5
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEES ADDRESS. DOCUMENT PREVIOUSLY RECORDED AT REEL 022168 FRAME 0882
Assignors:
Exec Dt:
05/14/2008
Exec Dt:
05/14/2008
Exec Dt:
05/14/2008
Assignee:
801 MINAMIFUDODO-CHO, HORIKAWAHIGASHIIRU
SHIOKOJI-DORI, SHIMOGYO-KU, KYOTO
KYOTO-SHI 600-8530, JAPAN
Correspondent:
WILLIAM T. ELLIS
FOLEY & LARDNER LLP
WASHINGTON HARBOUR
3000 K STREET NW, SUITE 500
WASHINGTON, D.C. 20007-5143

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