Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/01/2010
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Application #:
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12149014
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Filing Dt:
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04/24/2008
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Publication #:
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Pub Dt:
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05/14/2009
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Inventors:
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Joon-Seok Kang, Sung Yi, Jong-Hwan Baek, Young-Do Kweon
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Title:
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METHOD OF MANUFACTURING A WAFER LEVEL PACKAGE THAT USES THE SAME SEED LAYER FOR SELECTIVELY ELECTROPLATING A REWIRING PATTERN AND A CONDUCTIVE PILLAR
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 314, MAETAN3-DONG, YEONGTONG-GU, SUWON |
| GYUNGGI-DO, KOREA, REPUBLIC OF 443-743 |
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| STAAS & HALSEY LLP |
| ATTENTION; DAVID M. PITCHER |
| 1201 NEW YORK AVE., N.W. |
| SUITE 700 |
| WASHINGTON, DC 20005 |
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