Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11984781
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Filing Dt:
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11/21/2007
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Publication #:
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Pub Dt:
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05/21/2009
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Inventors:
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Wen-Kun Yang, Chi-Yu Wang, Hsien-Wen Hsu
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Title:
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Stacking die package structure for semiconductor devices and method of the same
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 65, GUANGFU N. RD., HUKOU TOWNSHIP |
HSINCHU COUNTY, TAIWAN R.O.C. 303 |
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JOE MCKINNEY MUNCY |
BIRCH, STEWART, KOLASCH & BIRCH, LLP |
8110 GATEHOUSE ROAD |
SUITE 100 EAST, P.O. BOX 747 |
FALLS CHURCH, VA 22040-0747 |
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