Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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02/18/2014
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Application #:
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11990875
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Filing Dt:
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02/22/2008
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Publication #:
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Pub Dt:
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05/21/2009
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Inventors:
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Osamu Miyata, Tadahiro Morifuji
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Title:
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SEMICONDUCTOR CHIP, METHOD OF MANUFACTURING SEMICONDUCTOR CHIP, AND SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 21, SAIIN MIZOSAKI-CHO, UKYO-KU, KYOTO-SHI |
| KYOTO, JAPAN 615-8585 |
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| ROBERT H. BERDO, JR. |
| RABIN & BERDO, PC |
| 1101 14TH ST., NW |
| SUITE 500 |
| WASHINGTON, D.C. 20005 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1891 ROBERTSON ROAD |
| SUITE 100 |
| OTTAWA, CANADA K2H 5B7 |
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| ACHLYS TECHNOLOGIES INC. |
| 1891 ROBERTSON ROAD |
| SUITE 100 |
| OTTAWA, K2H 5B7 CANADA |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, |
| HSINCHU, TAIWAN 300-78 |
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| JCIPRNET |
| 8F-1, NO. 100, ROOSEVELT RD. SEC. 2, |
| TAIPEI, 100404 TAIWAN |
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