Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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02/17/2015
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Application #:
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11816814
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Filing Dt:
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11/21/2008
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Publication #:
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Pub Dt:
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05/21/2009
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Inventors:
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Tsunehiko Nakamura, Tatsuya Maehara
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Title:
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Joined Assembly, Wafer Holding Assembly, Attaching Structure Thereof and Method for Processing Wafer
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6, TAKEDA TOBADONO-CHO, FUSHIMI-KU |
| KYOTO, JAPAN 612-8501 |
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| HOGAN & HARTSON L.L.P. |
| 1999 AVENUE OF THE STARS |
| SUITE 1400 |
| LOS ANGELES, CA 90067 |
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Assignment:
2
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RE-RECORD TO CORRECT THE ADDRESS OF THE ASSIGNEE, PREVIOUSLY RECORDED ON REEL 021871 FRAME 0453.
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| 6, TAKEDA TOBADONO-CHO, FUSHIMI-KU, |
| KYOTO-SHI, KYOTO 612-8501, JAPAN |
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| LAWRENCE J. MCCLURE, ESQ. |
| HOGAN & HARTSON L.L.P. |
| 1999 AVENUE OF THE STARS, SUITE 1400 |
| LOS ANGELES, CALIFORNIA 90067 |
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