Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11987229
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Filing Dt:
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11/28/2007
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Publication #:
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Pub Dt:
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05/28/2009
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Inventors:
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Kuo-Yuan Lee, Yung-Hsiang Chen
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Title:
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Semiconductor package and packaging method for balancing top and bottom mold flows from window
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 18, NORTH FIRST ROAD K.E.P.Z. |
| KAOHSIUNG, TAIWAN ROC |
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| JOE MCKINNEY MUNCY |
| BIRCH, STEWART, KOLASCH & BIRCH, LLP |
| 8110 GATEHOUSE ROAD, SUITE 100 EAST |
| P.O. BOX 747 |
| FALLS CHURCH, VA 22040-0747 |
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