Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/10/2011
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Application #:
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12277339
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Filing Dt:
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11/25/2008
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Publication #:
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Pub Dt:
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05/28/2009
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Inventor:
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Ki-Sub LEE
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Title:
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METHOD OF FILLING A TRENCH IN A SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 416, MAETAN-DONG, YEONGTONG-GU, |
| SUWON-SI, GYEONGGI-DO,, KOREA, REPUBLIC OF 442-742 |
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| VOLENTINE & WHITT, PLLC |
| 11951 FREEDOM DRIVE, SUITE 1260 |
| RESTON, VA 20190 |
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