Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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07/13/2010
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Application #:
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12273496
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Filing Dt:
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11/18/2008
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Publication #:
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Pub Dt:
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06/04/2009
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Inventor:
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Hsueh-Lung Cheng
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Title:
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HEAT DISSIPATING MODULE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3F., NO.37, SEC. 2, JHONGYANG S. RD., PEITOU DISTRICT, |
| TAIPEI, TAIWAN 112 |
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| JIANQ CHYUN INTELLECTUAL PROPERTY |
| 7F-1,NO.100,ROOSEVELT RD.,SEC.2, |
| TAIPEI, 100 TAIWAN |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5F., NO.76, LIGONG ST., BEITOU DISTRICT, |
| TAIPEI CITY 112, TAIWAN 112 |
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| JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE |
| 7F.-1, NO. 100, ROOSEVELT RD., SEC. 2, |
| TAIPEI, 100 TAIWAN |
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