Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/17/2015
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Application #:
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12297899
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Filing Dt:
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10/21/2008
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Publication #:
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Pub Dt:
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06/11/2009
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Inventors:
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Do Choul Woo, Min Hong Kim, Mi Gyeong Ko
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Title:
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METHOD OF FABRICATING LIGHT EMITTING DIODE PACKAGE WITH SURFACE TREATED RESIN ENCAPSULANT AND THE PACKAGE FABRICATED BY THE METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 148-29 GASAN-DONG, GEUMCHEON-GU, GYEONGGI-DO |
| SEOUL, KOREA, REPUBLIC OF 153-801 |
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| H.C. PARK & ASSOCIATES, PLC |
| 8500 LEESBURG PIKE, SUITE 7500 |
| VIENNA, VA 22182 |
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