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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
08/26/2014
Application #:
12330681
Filing Dt:
12/09/2008
Publication #:
Pub Dt:
06/11/2009
Inventors:
Saravuth SIRINORAKUL, Kasemsan Kongthaworn
Title:
FLIP-CHIP LEADFRAME SEMICONDUCTOR PACKAGE
Assignment: 1
Reel/Frame:
021946/0429Recorded: 12/09/2008Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/08/2008
Exec Dt:
12/08/2008
Assignee:
5 SERANGOON NORTH AVENUE 5
SINGAPORE, SINGAPORE 554916
Correspondent:
SUGHRUE MION, PLLC
2100 PENNSYLVANIA AVENUE, N.W.
SUITE 800
WASHINGTON, DC 20037
Assignment: 2
Reel/Frame:
043979/0820Recorded: 09/25/2017Pages: 18
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE INCLUDE PATENT NUMBER 8816482 PREVIOUSLY RECORDED AT REEL: 039885 FRAME: 0541. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignor:
Exec Dt:
05/08/2015
Assignee:
22 ANG MO KIO INDUSTRIAL PARK 2
SINGAPORE, SINGAPORE 569506
Correspondent:
HORIZON IP PTE. LTD.
7500A BEACH ROAD, #04-306/308
THE PLAZA
SINGAPORE, SINGAPORE

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