skip navigationU S P T O SealUnited States Patent and Trademark Office AOTW logo
Home|Site Index|Search|Guides|Contacts|eBusiness|eBiz alerts|News|Help
Assignments on the Web > Patent Query
Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
11921865
Filing Dt:
12/10/2007
Publication #:
Pub Dt:
06/11/2009
Inventors:
Maki Saitou, Shinichirou Kanai, Motohiro Seki, Kazuhito Okumura, Ikkou Hanaki et al
Title:
Release resin composition, molded compact thereof, and laminate product
Assignment: 1
Reel/Frame:
020421/0822Recorded: 12/10/2007Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/16/2007
Exec Dt:
10/12/2007
Exec Dt:
10/02/2007
Exec Dt:
10/12/2007
Exec Dt:
10/22/2007
Exec Dt:
10/22/2007
Exec Dt:
02/02/2007
Assignee:
1-1-2, SHIMOHOZUMI
IBARAKI-SHI, OSAKA, JAPAN
Correspondent:
KANESAKA BERNER & PARTNERS
1700 DIAGONAL ROAD, SUITE 310
ALEXANDRIA, VA 22314

Search Results as of: 03/29/2024 10:49 AM
If you have any comments or questions concerning the data displayed, contact PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified: August 25, 2017 v.2.6
| .HOME | INDEX| SEARCH | eBUSINESS | CONTACT US | PRIVACY STATEMENT