Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11885459
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Filing Dt:
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08/31/2007
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Publication #:
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Pub Dt:
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06/18/2009
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Inventors:
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Hidehiko Mishima, Yasuhito Masuda, Kenichi Watatani, Yasuhiro Okuda, Shuji Sakabe et al
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Title:
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Method for Processing Material by Laser Ablation and Material Processed by Processing Method Thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-33, KITAHAMA 4-CHOME, CHUO-KU, OSAKA-SHI |
| OSAKA 541-0041, JAPAN |
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| MCDERMOTT WILL & EMERY LLP |
| 600 13TH STREET, N.W. |
| WASHINGTON, D.C. 20005-3096 |
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