Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11957862
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Filing Dt:
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12/17/2007
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Publication #:
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Pub Dt:
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06/18/2009
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Inventors:
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Soo-San Park, BumJoon Hong, Sang-Ho Lee, DaeSik Choi, Jong-Woo Ha
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Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH FLIP CHIP
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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5 YISHUN STREET 23 |
SINGAPORE, SINGAPORE 768442 |
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MIKIO ISHIMARU |
LAW OFFICES OF MIKIO ISHIMARU |
333 W. EL CAMINO REAL, SUITE # 330 |
SUNNYVALE, CA 94087 |
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