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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
11957862
Filing Dt:
12/17/2007
Publication #:
Pub Dt:
06/18/2009
Inventors:
Soo-San Park, BumJoon Hong, Sang-Ho Lee, DaeSik Choi, Jong-Woo Ha
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH FLIP CHIP
Assignment: 1
Reel/Frame:
020257/0304Recorded: 12/17/2007Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/10/2007
Exec Dt:
12/10/2007
Exec Dt:
12/10/2007
Exec Dt:
12/10/2007
Exec Dt:
12/10/2007
Assignee:
5 YISHUN STREET 23
SINGAPORE, SINGAPORE 768442
Correspondent:
MIKIO ISHIMARU
LAW OFFICES OF MIKIO ISHIMARU
333 W. EL CAMINO REAL, SUITE # 330
SUNNYVALE, CA 94087

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