Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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02/08/2011
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Application #:
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12354520
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Filing Dt:
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01/15/2009
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Publication #:
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Pub Dt:
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06/18/2009
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Inventors:
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Fu Chiung Chong, Andrew Kao, Douglas Modlin, Sammy Mok, Nitin Parekh et al
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Title:
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HIGH DENSITY INTERCONNECT SYSTEM HAVING RAPID FABRICATION CYCLE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1100 LA AVENIDA STREET |
BUILDING A |
MOUNTAIN VIEW, CALIFORNIA 94043 |
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GREGORY W. OSTERLOTH |
P.O. BOX 8749 |
DENVER, CO 80201 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 1 YISHUN AVENUE 7 |
SINGAPORE, SINGAPORE 768923 |
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GREGORY W. OSTERLOTH |
P.O. BOX 8749 |
DENVER, CO 80201 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1, YISHUN AVENUE 7 |
SINGAPORE, SINGAPORE 768923 |
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GREGORY W. OSTERLOTH |
555 17TH STREET, SUITE 3200 |
DENVER, CO 80202 |
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