Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/05/2010
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Application #:
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11957730
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Filing Dt:
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12/17/2007
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Publication #:
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Pub Dt:
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06/18/2009
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Inventor:
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Steve Xin Liang
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Title:
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THERMAL MECHANICAL FLIP CHIP DIE BONDING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 20 SYLVAN ROAD |
| WOBURN, MASSACHUSETTS 01801 |
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| SARAH M. GATES |
| ONE MAIN STREET |
| CAMBRIDGE, MA 02142 |
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