Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12314361
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Filing Dt:
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12/09/2008
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Publication #:
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Pub Dt:
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06/18/2009
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Inventors:
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Won-keun Kim, Yong-kwan Lee
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Title:
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Backside protection film, method of forming the same and method of manufacturing a semiconductor package using the same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 416, MAETAN-DONG, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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| EUGENE M. LEE |
| LEE & MORSE, P.C. |
| 3141 FAIRVIEW PARK DRIVE |
| SUITE 500 |
| FALLS CHURCH, VA 22042 |
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