Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12225106
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Filing Dt:
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09/15/2008
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Publication #:
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Pub Dt:
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07/02/2009
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Inventors:
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Iji Onozuka, Masataka Arai, Takeshi Hosomi
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Title:
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Insulating Resin Layer, Insulating Resin Layer With Carrier And Multiple-Layered Printed Wiring Board
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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5-8, HIGASHI-SHINAGAWA 2-CHOME |
SHINAGAWA-KU |
TOKYO 140-0002, JAPAN |
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MICHAEL A. MAKUCH |
SMITH, GAMBRELL & RUSSELL, LLP |
1130 CONNECTICUT AVENUE, SUITE 1130 |
WASHINGTON, DC 20036 |
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