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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
12298285
Filing Dt:
10/23/2008
Publication #:
Pub Dt:
07/09/2009
Inventors:
Yoshimichi Sogawa, Takao Yamazaki, Nobuaki Takahashi
Title:
ELECTRONIC COMPONENT, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE
Assignment: 1
Reel/Frame:
021728/0640Recorded: 10/23/2008Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/01/2008
Exec Dt:
09/01/2008
Exec Dt:
09/01/2008
Assignees:
7-1, SHIBA 5-CHOME, MINATO-KU
TOKYO, JAPAN 108-8001
1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI
KANAGAWA, JAPAN 211-8668
Correspondent:
SUGHRUE MION, PLLC
2100 PENNSYLVANIA AVENUE, N.W.
SUITE 800
WASHINGTON, DC 20037
Assignment: 2
Reel/Frame:
025214/0678Recorded: 10/28/2010Pages: 9
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
04/01/2010
Assignee:
1753 SHIMONUMABE, NAKAHARA-KU,
KAWASAKI-SHI, KANAGAWA, JAPAN 211-8668
Correspondent:
SUGHRUE MION, PLLC
2100 PENNSYLVANIA AVENUE, N.W.
SUITE 800
WASHINGTON, DC 20037

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