Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/16/2013
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Application #:
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12316057
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Filing Dt:
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12/09/2008
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Publication #:
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Pub Dt:
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07/09/2009
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Inventor:
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Masahiro Hasegawa
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Title:
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Electronic element wafer module; electronic element module; sensor wafer module; sensor module; lens array plate; manufacturing method for the sensor module; and electronic information device
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 22-22 NAGAIKE-CHO |
| ABENO-KU, OSAKA-SHI |
| OSAKA, JAPAN 545-8522 |
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| GEORGE W. NEUNER |
| EDWARDS ANGELL PALMER & DODGE LLP |
| P.O. BOX 55874 |
| BOSTON, MA 02205 |
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