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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
12007887
Filing Dt:
01/16/2008
Publication #:
Pub Dt:
07/16/2009
Inventors:
Sheng-Shin Guo, Chia-Yang Chang, Teng-Sheng Chen, Yun-Lien Hsiao, Jung-Jung Kuo
Title:
Soft mold and fabrication method thereof
Assignment: 1
Reel/Frame:
020425/0241Recorded: 01/16/2008Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/10/2008
Exec Dt:
01/10/2008
Exec Dt:
01/10/2008
Exec Dt:
01/10/2008
Exec Dt:
01/10/2008
Assignee:
NO. 12, DUSING RD. 1
HSINCHU SCIENCE PARK, TAIWAN 30078, R.O.C.
Correspondent:
JOE MCKINNEY MUNCY
BIRCH STEWART KOLASCH, ET AL.
8110 GATEHOUSE ROAD, SUITE 100 EAST
P.O. BOX 747
FALLS CHURCH, VA 22040-0747

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