Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12137918
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Filing Dt:
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06/12/2008
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Publication #:
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Pub Dt:
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07/23/2009
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Inventors:
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Michael D. Brady, Brian L. Webb, Jinlin Peng, Mircea Despa, Po Ki Yuen, Keith A. Horn et al
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Title:
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Microcolumn-platform based array for high-throughput analysis
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SP-TI-03-1 |
| CORNING, NEW YORK 14831 |
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| CORNING INCORPORATED |
| SP-TI-3-1 |
| CORNING, NY 14831 |
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