Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/19/2011
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Application #:
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12223523
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Filing Dt:
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12/01/2008
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Publication #:
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Pub Dt:
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07/23/2009
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Inventors:
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Yoshikimi Kondo, Hiroshi Uchida, Kazuhiro Daikai
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Title:
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MICROCAPSULE-BASED HARDENER FOR EPOXY RESIN, MASTERBATCH-BASED HARDENER COMPOSITION FOR EPOXY RESIN, ONE-PART EPOXY RESIN COMPOSITION, AND PROCESSED GOOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-105, KANDA JINBOCHO, CHIYODA-KU |
| TOKYO, 101-8101, JAPAN |
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| STAAS & HALSEY LLP |
| ATTENTION: MARK J. HENRY |
| 1201 NEW YORK AVE., N.W., 7TH FLOOR |
| WASHINGTON, D.C. 20005 |
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