Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12019413
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Filing Dt:
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01/24/2008
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Publication #:
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Pub Dt:
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07/30/2009
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Inventors:
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Lap-Wai Lydia Leung, Chang Hwa Chung, Jie Liu, Chiu Lun Chan, Chi Kuen Leung
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Title:
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Electronic Circuit Package
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3RD FLOOR, BUILDING 6, |
| 2 SCIENCE PARK WEST AVENUE, HONG KONG SCIENCE PARK |
| SHATIN, NEW TERRITORIES, HONG KONG |
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| WELLS ST. JOHN P.S. |
| 601 W. FIRST AVENUE, SUITE 1300 |
| SPOKANE, WA 99201 |
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