Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12024847
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Filing Dt:
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02/01/2008
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Publication #:
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Pub Dt:
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08/06/2009
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Inventors:
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Yong Liu, Yumin Liu, Hua Yang, Tiburcio A. Maldo
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Title:
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Thin Compact Semiconductor Die Packages Suitable for Smart-Power Modules, Methods of Making the Same, and Systems Using the Same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 82 RUNNING HILL ROAD |
| MS 35-4E |
| SOUTH PORTLAND, MAINE US 04106 |
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| HAL R. YEAGER |
| TOWNSEND AND TOWNSEND AND CREW LLP |
| TWO EMBARCADERO CENTER, EIGHTH FLOOR |
| SAN FRANCISCO, CA 94111-3834 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 82 RUNNING HILL ROAD |
| SOUTH PORTLAND, MAINE 04106 |
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| TOWNSEND AND TOWNSEND AND CREW LLP |
| TWO EMBARCADERO CENTER |
| EIGHTH FLOOR |
| SAN FRANCISCO, CA 94111-3834 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5005 E. MCDOWELL ROAD, MD A700 |
| PHOENIX, ARIZONA 85008 |
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| SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 5005 E. MCDOWELL ROAD |
| MD A700 |
| PHOENIX, AZ 85008 |
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