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Patent Assignment Abstract of Title

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Total Assignments: 2

Patent #:	NONE	Issue Dt:		Application #:	12344023	Filing Dt:	12/24/2008
Publication #:	20090194871	Pub Dt:	08/06/2009
Inventors:	Denver Paul C. Castillo, Bryan Soon Hua Tan, Rodel Manalac, Kian Teng Eng, Pang Hup Ong et al
Title:	SEMICONDUCTOR PACKAGE AND METHOD OF ATTACHING SEMICONDUCTOR DIES TO SUBSTRATES

Assignment: 1

Reel/Frame:

022592/0186

Recorded: 04/24/2009

Pages: 5

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

CASTILLO, DENVER PAUL C.

Exec Dt:

01/12/2009

TAN, BRYAN SOON HUA

Exec Dt:

01/12/2009

MANALAC, RODEL

Exec Dt:

01/12/2009

ENG, KIEN TENG

Exec Dt:

01/12/2009

ONG, PANG HUP

Exec Dt:

01/12/2009

CHOW, SOO PIN

Exec Dt:

01/12/2009

HETZEL, WOLFGANG JOHANNES

Exec Dt:

01/12/2009

REISS, WERNER JOSEF

Exec Dt:

01/12/2009

AMMER, FLORIAN

Exec Dt:

01/12/2009

Assignee:

UNITED TEST AND ASSEMBLY CENTER, LTD

5 SERANGOON NORTH AVENUE 5

SINGAPORE, SINGAPORE 554916

Correspondent:

CARL J. PELLEGRINI

2100 PENNSYLVANIA AVENUE, N.W.

WASHINGTON, DC 20037

Assignment: 2

Reel/Frame:

023035/0961

Recorded: 07/31/2009

Pages: 7

Conveyance:

CORRECTIVE ASSIGNMENT TO CORRECT THE SECOND ASSIGNEE WAS OMITTED PREVIOUSLY RECORDED ON REEL 022592 FRAME 0186. ASSIGNOR(S) HEREBY CONFIRMS THE CORRECTED ASSIGNMENT.

Assignors:

CASTILLO, DENVER PAUL C.

Exec Dt:

01/12/2009