Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/15/2012
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Application #:
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12026312
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Filing Dt:
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02/05/2008
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Publication #:
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Pub Dt:
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08/06/2009
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Inventors:
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Shin-Puu Jeng, Yu-Wen Liu, Hao-Yi Tsai, Hsien-Wei Chen
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Title:
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BOND PAD STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN ROAD 6 |
| HSIN-CHU, TAIWAN 300-77 |
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| HAYNES AND BOONE, LLP |
| 901 MAIN STREET |
| SUITE 3100 |
| DALLAS, TX 75202 |
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