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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
01/11/2011
Application #:
12032158
Filing Dt:
02/15/2008
Publication #:
Pub Dt:
08/20/2009
Inventors:
Timothy Harrison Daubenspeck, Timothy D. Sullivan
Title:
SOLDER INTERCONNECT PADS WITH CURRENT SPREADING LAYERS
Assignment: 1
Reel/Frame:
020517/0277Recorded: 02/15/2008Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/14/2008
Exec Dt:
02/14/2008
Assignee:
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondent:
SCHMEISER, OLSEN & WATTS
22 CENTURY HILL DRIVE
SUITE 302
LATHAM, NY 12110
Assignment: 2
Reel/Frame:
028867/0216Recorded: 08/29/2012Pages: 27
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
07/18/2012
Assignee:
3050 ZANKER ROAD
SAN JOSE, CALIFORNIA 95134
Correspondent:
ALLSTON L. JONES
425 SHERMAN AVENUE, SUITE 230
PALO ALTO, CA 94306

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