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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
NONE
Issue Dt:
Application #:
11917674
Filing Dt:
12/14/2007
Publication #:
Pub Dt:
08/20/2009
Inventor:
Fumiaki Akase
Title:
Copper Foil for Printed Wiring Board
Assignment: 1
Reel/Frame:
020268/0490Recorded: 12/18/2007Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/05/2007
Assignee:
10-1, TORANOMON 2-CHOME
MINATO-KU, TOKYO, JAPAN 105-0001
Correspondent:
HOWSON & HOWSON LLP
SUITE 210, 501 OFFICE CENTER DRIVE
FT. WASHINGTON, PA 19034
Assignment: 2
Reel/Frame:
025115/0062Recorded: 10/08/2010Pages: 10
Conveyance:
MERGER (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
07/01/2010
Assignee:
10-1, TORANOMON 2-CHOME
MINATO-KU
TOKYO, JAPAN 105-0001
Correspondent:
WILLIAM BAK, HOWSON & HOWSON LLP
501 OFFICE CENTER DRIVE
SUITE 210
FORT WASHINGTON, PA 19034
Assignment: 3
Reel/Frame:
025123/0358Recorded: 10/12/2010Pages: 8
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
07/01/2010
Assignee:
6-3, OTEMACHI 2-CHOME
CHIYODA-KU
TOKYO, JAPAN 100-8164
Correspondent:
WILLIAM BAK, HOWSON & HOWSON LLP
501 OFFICE CENTER DRIVE
SUITE 210
FORT WASHINGTON, PA 19034

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