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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
12035742
Filing Dt:
02/22/2008
Publication #:
Pub Dt:
08/27/2009
Inventors:
Feng-Ku WANG, Chih-Kai YANG, Wei-Hsin WU
Title:
HEATSINK MODULE HAVING FIN ASSEMBLY STRUCTURE CORRESPONDING TO HEAT PIPE
Assignment: 1
Reel/Frame:
020547/0563Recorded: 02/22/2008Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/12/2008
Exec Dt:
02/12/2008
Exec Dt:
02/12/2008
Assignee:
NO. 66, HOU-KANG STREET
SHIH-LIN DIST.
TAIPEI, TAIWAN
Correspondent:
R. BURNS ISRAELSEN
60 EAST SOUTH TEMPLE
1000 EAGLE GATE TOWER
SALT LAKE CITY, UT 84111

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