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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
03/26/2013
Application #:
12389011
Filing Dt:
02/19/2009
Publication #:
Pub Dt:
08/27/2009
Inventors:
Leif Steen Johansen, Per F. H¿vesten, Gino Rocca
Title:
MINIATURE MICROPHONE ASSEMBLY WITH SOLDER SEALING RING
Assignment: 1
Reel/Frame:
022602/0723Recorded: 04/28/2009Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/16/2009
Exec Dt:
03/16/2009
Exec Dt:
03/16/2009
Assignee:
BYLEDDET 12-14
ROSKILDE, DENMARK DK-400
Correspondent:
DANIEL J. BURNHAM/SANDRA JOHNSON
161 N. CLARK STREET
CHICAGO, IL 60601
Assignment: 2
Reel/Frame:
029647/0458Recorded: 01/17/2013Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
07/30/2012
Assignee:
166 KALLANG WAY
SINGAPORE, SINGAPORE 349249
Correspondent:
NIXON PEABODY LLP
300 S. RIVERSIDE PLAZA
16TH FLOOR
CHICAGO, IL 60606
Assignment: 3
Reel/Frame:
041132/0144Recorded: 01/31/2017Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/01/2016
Assignee:
3-9-1 SHIBAURA
MINATO-KU
TOKYO, JAPAN 108-0023
Correspondent:
JUSTIN D. SWINDELLS
NIXON PEABODY LLP
70 WEST MADISON STREET
CHICAGO, IL 60602

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