Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/18/2014
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Application #:
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11921861
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Filing Dt:
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03/13/2009
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Publication #:
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Pub Dt:
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09/03/2009
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Inventors:
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Ryoichi Kurata, Daisuke Soma, Hiroshi Okada
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Title:
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Method of soldering portions plated by electroless ni plating
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 23 SENJU-HASHIDO-CHO, ADACHI-KU |
| TOKYO 120-8555, JAPAN |
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| MICHAEL TOBIAS |
| 1629 K STREET N.W, SUITE 300 |
| WASHINGTON, D.C. 20006 |
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