Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12230353
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Filing Dt:
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08/28/2008
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Publication #:
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Pub Dt:
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09/10/2009
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Inventors:
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Masaru Nakajo, Masahiro Izumi, Shinsuke Miyabe, Kuniaki Maejima, Hiroaki Tanaka
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Title:
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Polishing compound for semiconductor wafer polishing and polishing method
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 11-1 KAMEIDO 9-CHOME |
| KOTO-KU, TOKYO (50%), JAPAN 136-8515 |
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| 2647 HAYAKAWA, AYASE-SHI |
| KANAGAWA (50%), JAPAN 252-1123 |
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| H. JAY SPIEGEL |
| P.O. BOX 11 |
| MOUNT VERNON, VIRGINIA 22121 |
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