Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12213217
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Filing Dt:
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06/17/2008
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Publication #:
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Pub Dt:
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09/17/2009
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Inventor:
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Cheng-Hong Su
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Title:
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Semiconductor package structure, lead frame and conductive assembly for the same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 25, GUANGPU WEST ROAD |
| GUANGZHOU SCIENCE PARK, GUANGZHOU HIGH AND NEW TECHNOLOGY INDUSTRY DEVELOPMENT ZONE |
| GUANGZHOU, CHINA P.R.C. |
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| 22F, NO. 392, RUEY KUANG ROAD |
| NEI-HU DIST. |
| TAIPEI, TAIWAN R.O.C. |
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| ROSENBERG, KLEIN & LEE |
| 3458 ELLICOTT CENTER DRIVE-SUITE 101 |
| ELLICOTT CITY, MD 21043 |
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