Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12382008
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Filing Dt:
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03/05/2009
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Publication #:
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Pub Dt:
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09/17/2009
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Inventors:
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Myung-Beom Park, Ki-Hag Lee, Hyun-Su Kim, Eun-Ok Lee, Jung-Sik Choi, Byung-Hee Kim et al
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Title:
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Method of forming an ohmic layer and method of forming a metal wiring of a semiconductor device using the same
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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416, MAETAN-DONG, YEONGTONG-GU |
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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EUGENE M. LEE |
LEE & MORSE, P.C. |
3141 FAIRVIEW PARK DRIVE, SUITE 500 |
FALLS CHURCH, VA 22042 |
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