Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11884483
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Filing Dt:
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01/03/2008
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Publication #:
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Pub Dt:
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09/24/2009
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Inventor:
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Myung-Jae Lee
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Title:
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Chip Scale Package Tray
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 209-4 HWARIHYEON-RI, HYANGNAM-EUP |
| HWASEONG-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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| ROBERT E. BUSHNELL |
| ATTORNEY AT LAW |
| 2029 "K" STREET, N.W. SUITE 600 |
| WASHINGTON, D.C. 20006-1004 |
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