Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12309979
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Filing Dt:
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02/05/2009
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Publication #:
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Pub Dt:
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09/24/2009
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Inventors:
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Toshiaki Yamada, Hidenori Iida, Yasukazu Anbai, Shin Teraki, Masaki Yoshida et al
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Title:
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THERMOSETTING RESIN COMPOSITION AND UNCURED FILM COMPRISING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3993, NIGORIKAWA, KITA-KU, NIIGATA-SHI |
| NIIGATA, JAPAN 950-3131 |
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| FRISHAUF, HOLTZ, GOODMAN & CHICK, P.C. |
| 220 FIFTH AVENUE, 16TH FLOOR |
| NEW YORK, NEW YORK 10001-7708 |
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