Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/24/2012
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Application #:
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12302157
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Filing Dt:
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11/24/2008
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Publication #:
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Pub Dt:
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10/01/2009
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Inventors:
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Akio Furusawa, Kenichiro Suetsugu, Shigeki Sakaguchi, Kimiaki Nakaya
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Title:
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BONDING MATERIAL, ELECTRONIC COMPONENT, BONDING STRUCTURE AND ELECTRONIC DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1006 OAZA KADOMA, KADOMA-SHI |
| OSAKA, JAPAN 571-8501 |
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| KENJI KAMATA |
| 1130 CONNECTICUT AVE., N.W., SUITE 1100 |
| PANASONIC PATENT CENTER |
| WASHINGTON, DC 20036 |
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