Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12081664
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Filing Dt:
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04/21/2008
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Publication #:
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Pub Dt:
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10/01/2009
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Inventor:
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Chin-Ti Chen
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Title:
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Semiconductor package structure
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 26, DATONG RD., HSINCHU INDUSTRIAL PARK, HUKOU |
| HSINCHU 30352, TAIWAN R.O.C. |
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| MORTON J. ROSENBERG, ESQ. |
| ROSENBERG, KLEIN & LEE |
| 3458 ELLICOTT CENTER DRIVE |
| SUITE 101 |
| ELLICOTT CITY, MD 21043 |
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