Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/26/2013
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Application #:
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12412368
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Filing Dt:
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03/27/2009
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Publication #:
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Pub Dt:
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10/08/2009
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Inventors:
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Takayuki Nishiura, Yoshio Mezaki, Yoshiki Yabuhara
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Title:
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METHOD OF PACKAGING COMPOUND SEMICONDUCTOR SUBSTRATES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-33 KITAHAMA 4-CHOME, CHUO-KU |
| OSAKA-SHI, JAPAN 541-0041 |
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| JUDGE PATENT ASSOCIATES |
| DOJIMA BUILDING, 5TH FLOOR |
| 6-8 NISHITEMMA 2-CHOME, KITA-KU |
| OSAKA-SHI, 530-0047 JAPAN |
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