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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
12115300
Filing Dt:
05/05/2008
Publication #:
20090250816
Pub Dt:
10/08/2009
Inventors:
Tsung Shune CHIN, Ting Yi Lin, Huai Yu Cheng, Jau Shiung Fang, Chin Fu Chiu
Title:
ULTRA-THIN DIFFUSION-BARRIER LAYER FOR CU METALLIZATION
Assignment: 1
Reel/Frame:
021035/0299Recorded: 06/03/2008Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
CHIN, TSUNG SHUNE
Exec Dt:
05/02/2008
LIN, TING YI
Exec Dt:
05/02/2008
CHENG, HUAI YU
Exec Dt:
05/02/2008
FANG, JAU SHIUNG
Exec Dt:
05/02/2008
CHIU, CHIN FU
Exec Dt:
05/02/2008
Assignee:
CHIN, TSUNG SHUNE
NO. 30, BAOSHAN 6TH ST.,
BAOSHAN TOWNSHIP
HSINCHU COUNTY, TAIWAN 308
Correspondent:
BENJAMIN HAUPTMAN
1700 DIAGONAL ROAD, SUITE 310
ALEXANDRIA, VA 22314
Assignment: 2
Reel/Frame:
021784/0745Recorded: 11/04/2008Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
CHIN, TSUNG SHUNE
Exec Dt:
10/24/2008
Assignee:
NATIONAL TSING HUA UNIVERSITY
NO. 101, SECTION 2, KUANG-FU RD.,
HSINCHU, TAIWAN 30043
Correspondent:
LOWE HAUPTMAN HAM & BERNER, LLP
1700 DIAGONAL ROAD
SUITE 300
ALEXANDRIA, VA 22314

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