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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
12085152
Filing Dt:
05/15/2008
Publication #:
Pub Dt:
10/15/2009
Inventors:
Kazuhiro Ishikawa, Katsuitsu Nishida, Takahiro Nakahashi, Kazuya Fujita
Title:
Semiconductor Package, Method for Manufacturing the Same, Semiconductor Module, and Electronic Device
Assignment: 1
Reel/Frame:
020991/0743Recorded: 05/15/2008Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
04/25/2008
Assignee:
22-22, NAGAIKE-CHO
ABENO-KU
OSAKA-SHI, JAPAN 545-8522
Correspondent:
EDWARDS ANGELL PALMER & DODGE LLP
P.O. BOX 55874
BOSTON, MA 02205
Assignment: 2
Reel/Frame:
020991/0756Recorded: 05/15/2008Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/25/2008
Exec Dt:
04/25/2008
Exec Dt:
05/06/2008
Assignee:
22-22 NAGAIKE-CHO ABENO-KU
OSAKA-SHI, JAPAN 545-8522
Correspondent:
DAIVD G. CONLIN
EDWARS ANGELL PALMER & DODGE LLP
P.O. BOX 55874
BOSTON, MA 02205

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