Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/19/2011
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Application #:
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12453144
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Filing Dt:
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04/30/2009
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Publication #:
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Pub Dt:
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11/05/2009
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Inventors:
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Sung-Yong Park, Tae-Je Cho, Tae-Hun Kim, Jong-Kook Kim, Byeong-Yeon Cho
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Title:
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INTERPOSER CHIP AND MULTI-CHIP PACKAGE HAVING THE INTERPOSER CHIP
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 416, MAETAN-DONG, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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| HARNESS, DICKEY & PIERCE, P.L.C. |
| P.O. BOX 8910 |
| RESTON, VA 20195 |
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