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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
12505011
Filing Dt:
07/17/2009
Publication #:
Pub Dt:
11/05/2009
Inventors:
Yoichiro Kurita, Koji Soejima, Masaya Kawano
Title:
SEMICONDUCTOR MODULE HAVING AN INTERCONNECTION STRUCTURE
Assignment: 1
Reel/Frame:
022970/0888Recorded: 07/17/2009Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/25/2006
Exec Dt:
09/25/2006
Exec Dt:
09/25/2006
Assignee:
1753 SHIMONUMABE, NAKAHARA-KU
KAWASAKI
KANAGAWA, JAPAN 211-8668
Correspondent:
YOUNG & THOMPSON
209 MADISON STREET
SUITE 500
ALEXANDRIA, VA 22314
Assignment: 2
Reel/Frame:
025193/0156Recorded: 10/26/2010Pages: 9
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
04/01/2010
Assignee:
1753 SHIMONUMABE, NAKAHARA-KU,
KAWASAKI-SHI, KANAGAWA, JAPAN 211-8668
Correspondent:
SUGHRUE MION, PLLC
2100 PENNSYLVANIA AVENUE, N.W.
SUITE 800
WASHINGTON, DC 20037

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