Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12429476
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Filing Dt:
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04/24/2009
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Publication #:
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Pub Dt:
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11/12/2009
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Inventors:
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Yao-Kai Chuang, Chih-Ming Chung, Chien Liu, Chao-Cheng Liu
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Title:
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STACKED TYPE CHIP PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 26, CHIN 3RD., 811, NANTZE EXPORT |
| PROCESSING ZONE, KAOHSIUNG, TAIWAN R.O.C. |
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| J. C. PATENTS |
| 4, VENTURE SUITE 250 |
| IRVINE, CA 92618 |
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