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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
12292968
Filing Dt:
12/01/2008
Publication #:
Pub Dt:
11/12/2009
Inventors:
Juha T. Rantala, Nigel Hacker, William McLaughlin, Teemu T. Tormanen, Jason Reid
Title:
Dielectric materials and methods for integrated circuit applications
Assignment: 1
Reel/Frame:
026066/0587Recorded: 04/04/2011Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/12/2011
Exec Dt:
02/04/2011
Exec Dt:
03/15/2011
Exec Dt:
01/11/2011
Exec Dt:
12/10/2010
Assignee:
KUTOJANTIE 2 B
ESPOO, FINLAND FI-02630
Correspondent:
SEPPO LAINE OY JOSHUA P. WERT
ITAMERENKATU 3 B
HELSINKI, FI-00180 FINLAND

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