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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
02/15/2011
Application #:
12085277
Filing Dt:
05/20/2008
Publication #:
Pub Dt:
11/19/2009
Inventor:
Andreas Volek
Title:
SOLDER MATERIAL FOR SOLDERING COMPONENTS
Assignment: 1
Reel/Frame:
021005/0367Recorded: 05/20/2008Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
04/05/2008
Assignees:
WITTELSBACHERPLATZ 2
MUENCHEN, GERMANY 80333
DACHAUER STRASSE 665
MUENCHEN, GERMANY 80995
Correspondent:
ELSA KELLER
SIEMENS CORPORATION
INTELLECTUAL PROPERTY DEPARTMENT
170 WOOD AVENUE SOUTH
ISELIN, NJ 08830
Assignment: 2
Reel/Frame:
035022/0477Recorded: 02/25/2015Pages: 8
Conveyance:
MERGER (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
03/12/2013
Assignee:
DECHAUER STRASSE 665
MUENCHEN, GERMANY 80995
Correspondent:
SIEMENS CORPORATION - IP DEPT
3501 QUADRANGLE BLVD, SUITE 230
ORLANDO, FL 32817
Assignment: 3
Reel/Frame:
039122/0859Recorded: 07/11/2016Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
05/20/2016
Assignee:
DACHAUER STRASSE 665
INTELLECTUAL PROPERTY MANAGEMENT
MUNICH, GERMANY D-80995
Correspondent:
ABEL LAW GROUP LLP
8911 N. CAPITAL OF TEXAS HWY
BLDG 4, STE 4200
AUSTIN, TX 78759

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