Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12085964
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Filing Dt:
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06/03/2008
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Publication #:
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Pub Dt:
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11/26/2009
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Inventors:
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Katsumi Terada, Mikio Kawakami
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Title:
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Chip Mounting Apparatus and Chip Mounting Method
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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6-14, MINAMI-HONMACHI 3-CHOME, CHUO-KU |
OSAKA-SHI, OSAKA, JAPAN 541-0054 |
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PAUL C. LEWIS |
BIRCH, STEWART, KOLASCH & BIRCH, LLP |
8110 GATEHOUSE ROAD |
SUITE 100 EAST, P.O. BOX 747 |
FALLS CHURCH, VA 22040-0747 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NIHONBASHI MUROMACHI BLDG., 3-16 |
NIHONBASHI, HONGOKUCHO 3-CHOME |
CHUO-KU, TOKYO, 103-0021, JAPAN |
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RANDOLPH A. SMITH |
SMITH PATENT OFFICE |
1901 PENNSYLVANIA AVE., N.W. |
SUITE 901 |
WASHINGTON, D.C. 20006-3433 |
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