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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/15/2011
Application #:
12474173
Filing Dt:
05/28/2009
Publication #:
Pub Dt:
12/03/2009
Inventor:
Lawrence W. Tiffin
Title:
CIRCUIT MODULE WITH NON-CONTACTING MICROWAVE INTERLAYER INTERCONNECT
Assignment: 1
Reel/Frame:
022864/0257Recorded: 06/23/2009Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
06/09/2009
Assignee:
870 WINTER STREET
WALTHAM, MASSACHUSETTS 02451
Correspondent:
SOCAL IP LAW GROUP LLP
310 N. WESTLAKE BLVD., SUITE 120
WESTLAKE VILLAGE, CA 91362

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