Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/18/2010
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Application #:
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12473122
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Filing Dt:
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05/27/2009
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Publication #:
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Pub Dt:
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12/03/2009
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Inventors:
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Akihiko Endo, Tatsumi Kusaba
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Title:
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METHOD FOR PRODUCING BONDED WAFER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-1, SHIBAURA 1-CHOME, MINATO-KU |
| TOKYO, JAPAN 105-8634 |
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| BABAK KUSHA |
| TOWNSEND AND TOWNSEND AND CREW LLP |
| TWO EMBARCADERO CENTER, EIGHTH FLOOR |
| SAN FRANCISCO, CALIFORNIA 94111-3834 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-1, SHIBAURA 1-CHOME, MINATO-KU |
| TOKYO, JAPAN 105-8634 |
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| BABAK KUSHA |
| TOWNSEND AND TOWNSEND AND CREW LLP |
| TWO EMBARCADERO CENTER |
| EIGHTH FLOOR |
| SAN FRANCISCO, CA 94111-3834 |
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